This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Su-Jen Sung
Introduction
Su-Jen Sung is a prominent inventor based in Zhubei City, Taiwan. She has made significant contributions to the field of semiconductor technology, particularly in wafer bonding techniques. Her innovative approach has led to advancements that enhance the performance and efficiency of integrated circuits.
Latest Patents
Su-Jen Sung holds a patent for a method titled "Wafer bonding incorporating thermal conductive paths." This patent describes a process that includes forming a first bond layer on a first wafer and creating a first thermal conductive channel that extends into the first bond layer. The first thermal conductive channel possesses a higher thermal conductivity value than the bond layer itself. Additionally, the method involves forming a second bond layer on a second wafer, along with a second thermal conductive channel that also has a higher thermal conductivity value than its corresponding bond layer. The first wafer is then bonded to the second wafer, ensuring that the thermal conductive channels physically contact each other. An interconnect structure is formed over the first wafer, which is electrically connected to integrated circuit devices within it. Su-Jen Sung has 1 patent to her name.
Career Highlights
Su-Jen Sung is currently employed at Taiwan Semiconductor Manufacturing Company, a leading firm in the semiconductor industry. Her work focuses on developing innovative solutions that improve the efficiency and reliability of semiconductor devices.
Collaborations
Throughout her career, Su-Jen has collaborated with notable colleagues, including Guan-Yao Tu and Tze-Liang Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Su-Jen Sung's contributions to wafer bonding technology exemplify her commitment to innovation in the semiconductor field. Her work continues to influence the development of advanced integrated circuits, showcasing her role as a key inventor in this industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile