Tongluo, Taiwan

Su-Chia Lu


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Tangluo Township, Miaoli County, TW (2006)
  • Tongluo Township, Miaoli County, TW (2008)

Company Filing History:


Years Active: 2006-2008

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2 patents (USPTO):Explore Patents

Title: Innovations by Su-Chia Lu

Introduction

Su-Chia Lu is a notable inventor based in Tongluo, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the fabrication of conductive bumps for electronic assemblies. With a total of 2 patents, his work has advanced the technology used in flip chip electronic assemblies.

Latest Patents

Su-Chia Lu's latest patents include a method for fabricating conductive bumps with non-conductive juxtaposed sidewalls. This innovative microelectronic structure features a substrate of multiple conductive bumps designed for contact with bond pads on an electronic substrate. The conductive bumps are engineered to include a conductive layer that is absent from at least one sidewall, effectively preventing the inadvertent formation of short-circuiting electrical paths between adjacent conductive bumps in the electronic assembly.

Career Highlights

Su-Chia Lu is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of microelectronic technology. His work has been instrumental in enhancing the reliability and efficiency of electronic components.

Collaborations

Some of his notable coworkers include Yuan-Chang Huang and Shyh-Ming Chang, who have collaborated with him on various projects within the field.

Conclusion

Su-Chia Lu's contributions to microelectronics through his innovative patents demonstrate his commitment to advancing technology in this critical area. His work not only enhances the functionality of electronic devices but also sets a foundation for future innovations in the industry.

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