The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Dec. 22, 2006
Yuan-chang Huang, Banchian, TW;
Shyh-ming Chang, Hsinchu, TW;
Su-chia LU, Tongluo Township, Miaoli County, TW;
Yuan-Chang Huang, Banchian, TW;
Shyh-Ming Chang, Hsinchu, TW;
Su-Chia Lu, Tongluo Township, Miaoli County, TW;
Industrial Technology Research Institute, Chutung, Hsinchu, TW;
Abstract
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile