Cheongwon, South Korea

Su-Byeong Chae

This inventor holds 1 USPTO granted patent. Top assignee: Korea University Research and Business Foundation. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Su-Byeong Chae. Retrieved from https://idiyas.com/inventor/su-byeong-chae

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Su-Byeong Chae in Copper Film Technology

Introduction: Su-Byeong Chae is a notable inventor based in Cheongwon, South Korea. He has made significant contributions to the field of materials science, particularly in the development of methods for forming copper films on flexible substrates. His innovative approach has implications for various applications in electronics and manufacturing.

Latest Patents: Su-Byeong Chae holds a patent for a method of forming a copper film on a Mo/SUS flexible substrate. This invention enables the copper film to be uniformly formed on the substrate in a short period of time by applying current. The thickness of the copper film increases proportionally with the concentration of a copper precursor aqueous solution or the current density.

Career Highlights: Su-Byeong Chae is affiliated with the Korea University Research and Business Foundation, where he continues to advance research in materials technology. His work has garnered attention for its practical applications in the electronics industry.

Collaborations: Some of his notable coworkers include Chi-woo Lee and Jeom-Sik Yang, who have collaborated with him on various research projects.

Conclusion: Su-Byeong Chae's innovative methods for forming copper films represent a significant advancement in materials science. His contributions are paving the way for future developments in flexible electronics and related fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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