The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Nov. 26, 2013
Applicant:
Korea University Research and Business Foundation, Seoul, KR;
Inventors:
Chi-Woo Lee, Seoul, KR;
Mi-Kyung Oh, Sejong, KR;
Jeom-Sik Yang, Seoul, KR;
Su-Byeong Chae, Cheongwon-gun, KR;
Sang-Min Lee, Pyeongtaek, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); H01B 1/02 (2006.01); B32B 15/01 (2006.01); C22C 9/00 (2006.01); H01L 31/032 (2006.01); H01L 31/0392 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); H01L 31/0322 (2013.01); H01L 31/03928 (2013.01); Y10T 428/12826 (2015.01);
Abstract
This invention relates to a method of forming a copper film on a Mo/SUS flexible substrate, which enables the copper film to be uniformly formed on the Mo/SUS flexible substrate in a short period of time by applying current and in which the copper film becomes thicker in proportion to an increase in a concentration of a copper precursor aqueous solution or in a current density.
Lee, Chi-Woo. (2016). Method of forming copper film on mo/sus flexible substrate (U.S. Patent No. 9281094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9281094
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile