Townsend, MA, United States of America

Steven Imperalli



 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: The Innovations of Steven Imperalli

Introduction

Steven Imperalli is an accomplished inventor based in Townsend, MA (US). He holds a patent for a unique invention that enhances circuit board technology. His work has contributed significantly to the field of electronics and interconnect systems.

Latest Patents

Steven Imperalli's notable patent is titled "Slot and memory module for a slot standing interconnect." This invention features a controlled-depth slot extending into a circuit board, which can be milled and includes radial plated through-holes to create a solderable 'D' interconnect feature. The design allows for interconnect features on one to five sides, facilitating the integration of various solderable technology modules. These modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices, anti-tamper devices, capacitance devices, and Field Programmable Gate Arrays (FPGAs). This innovative approach secures the modules within the slot while connecting them to the circuit board's interconnects.

Career Highlights

Throughout his career, Steven has worked with prominent companies, including Mercury Computer Systems, Inc. and Mercury Systems, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in technology.

Collaborations

Steven has collaborated with talented individuals such as Darryl J McKenney and Daniel Toohey. These partnerships have fostered a creative environment that has led to innovative solutions in the field of electronics.

Conclusion

Steven Imperalli's contributions to circuit board technology through his patent and collaborative efforts highlight his role as a significant inventor in the electronics industry. His work continues to influence advancements in interconnect systems and technology integration.

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