The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Aug. 31, 2012
Darryl J. Mckenney, Londonderry, NH (US);
Daniel Toohey, South Grafton, MA (US);
Stephen Mariani, Randolph, MA (US);
Michael Gust, Westford, MA (US);
Absu Methratta, Waltham, MA (US);
Timothy Fleury, Princeton, MA (US);
Steven Imperalli, Townsend, MA (US);
Darryl J. McKenney, Londonderry, NH (US);
Daniel Toohey, South Grafton, MA (US);
Stephen Mariani, Randolph, MA (US);
Michael Gust, Westford, MA (US);
Absu Methratta, Waltham, MA (US);
Timothy Fleury, Princeton, MA (US);
Steven Imperalli, Townsend, MA (US);
MERCURY COMPUTER SYSTEMS, INC., Chelmsford, MA (US);
Abstract
According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable 'D' interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.