Steven F VanLiew

Title: Innovations of Steven F VanLiew

Introduction

Steven F VanLiew is a notable inventor based in El Segundo, CA (US). He has made significant contributions to the field of multi-chip module technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic components used in various applications, particularly in space technology.

Latest Patents

One of his latest patents is for a "Postless large multichip module with ceramic lid for space applications." This innovative design features a large size multi-chip module package equipped with a new lid made of Kovar™ framed sheet of Alumina, which is at least 0.04 inches thick. This design is tolerant of differential pressures of at least one atmosphere and is reworkable. The rigidity of the Alumina sheet addresses the issue of excess deflection found in previous lids, allowing for the elimination of internal lid support posts. This advancement frees up internal space within the MCM package for additional electronic circuitry and components.

Another significant patent is for a "Ceramic lid for large multi-chip modules." This reworkable multi-chip module includes a large package with an opening at the top, allowing access to an internal region for semiconductor devices. The opening measures at least four square inches, with dimensions of at least two inches. The opening is sealed with a stiff closure that can withstand at least one atmosphere of differential pressure without significant deflection. This closure is designed to be removable in a single piece and can be reinstalled, enhancing the module's functionality.

Career Highlights

Steven VanLiew has been instrumental in advancing multi-chip module technology through his innovative designs. His work at TRW Limited has positioned him as a key figure in the development of reliable electronic components for critical applications.

Collaborations

He has collaborated with notable coworkers, including Mary C Massey and Ryan S Berkely, contributing to the success of various projects within his field.

Conclusion

Steven F VanLiew's contributions to multi-chip module technology reflect his commitment to innovation and excellence. His patents demonstrate a clear understanding of the challenges in electronic component design, particularly for space applications. His work continues to influence the industry and pave the way for future advancements.