The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Feb. 17, 1999
Mary C. Massey, Manhattan Beach, CA (US);
Steven F. VanLiew, El Segundo, CA (US);
Ryan S. Berkely, Long Beach, CA (US);
TRW Inc., Redondo Beach, CA (US);
Abstract
Large size multi-chip module packages are fitted with a new lid (,) formed of a Kovar™ (,) framed sheet of Alumina (,) no less than 0.04 inches thick to form a new “postless” MCM package,(FIG.,and FIG.,) that is tolerant of differential pressures of at least one atmosphere and is reworkable. The rigidity of the Alumina sheet avoids the problem of excess deflection found in the prior lids for the package. It also permits elimination of internal lid support posts, freeing internal area within the MCM package that may be used to seat additional electronic circuitry and/or components.