Company Filing History:
Years Active: 2005
Title: Steve Thummel: Innovator in Semiconductor Technology
Introduction
Steve Thummel is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods for forming circuit traces and contact pads.
Latest Patents
Thummel holds a patent for "Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages." This invention encompasses methods of preparing interposers for utilization in semiconductor packages. The methodology includes providing an interposer substrate with a surface and a conductive layer extending over it. Pads are formed on the conductive layer by plating a conductive material while using the conductive layer as an electrical connection to a power source, without utilizing conductive busses. After the pads are formed, the conductive layer is patterned into circuit traces. This invention can be utilized for forming board-on-chip constructions. He has 1 patent to his name.
Career Highlights
Steve Thummel has had a distinguished career at Micron Technology Incorporated, where he has been instrumental in advancing semiconductor technologies. His work has contributed to the development of more efficient and effective semiconductor packages.
Collaborations
Thummel has collaborated with notable colleagues, including Stephen F Moxham and Lee Teck Kheng, to further enhance innovations in the semiconductor field.
Conclusion
Steve Thummel's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of efficient semiconductor packages.