Company Filing History:
Years Active: 1992-1993
Title: Innovations of Stephen Laderman
Introduction
Stephen Laderman is a notable inventor based in Menlo Park, California. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit. His work primarily focuses on the fabrication of semiconductor devices, which are crucial for modern electronics.
Latest Patents
Laderman's latest patents include a method for fabricating a semiconductor device with strained Si.sub.1-x Ge.sub.x. This invention involves creating a heteroepitaxial layer under strain, which enhances the performance of semiconductor devices. The process includes growing a second strained heteroepitaxial layer on a first crystalline layer and subsequently depositing a third crystalline layer to prevent misfit dislocations. His other patent addresses semiconductor processing with a silicon cap over Si.sub.1-x Ge.sub.x film, which improves device performance by reducing misfit dislocations during thermal processing.
Career Highlights
Stephen Laderman has had a distinguished career at Hewlett-Packard Company, where he has applied his innovative ideas to advance semiconductor technology. His work has been instrumental in developing improved devices that utilize silicon to SiGe alloy heterojunctions. His research has contributed to a deeper understanding of dislocation formation and thermal stability in semiconductor materials.
Collaborations
Laderman has collaborated with esteemed colleagues such as Martin P. Scott and Theodore I. Kamins. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the semiconductor field.
Conclusion
Stephen Laderman's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in electronics and semiconductor fabrication.