Stephen G Bennett

Title: The Innovative Contributions of Stephen G Bennett

Introduction

Stephen G Bennett is a notable inventor based in Niskayuna, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to through substrate vias (TSVs). His work has implications for the integration of advanced devices in the semiconductor industry.

Latest Patents

Stephen G Bennett holds a patent for an "Apparatus and method for integration of through substrate vias." This patent describes an apparatus that includes a semiconducting layer, one or more CMOS devices mounted on the top surface of the semiconducting layer, and one or more TSVs integrated into the semiconducting layer of the device wafer. The method outlined in the patent involves several processing steps on a wafer of semiconducting material, which enhances the efficiency of device manufacturing. He has 1 patent to his name.

Career Highlights

Stephen G Bennett is affiliated with the State University of New York, where he contributes to research and development in semiconductor technologies. His expertise in integrating TSVs into devices has positioned him as a valuable asset in the field. His work not only advances technology but also supports educational initiatives within the university.

Collaborations

Stephen has collaborated with talented individuals such as Jeremiah Hebding and Megha Rao. These collaborations have fostered a productive environment for innovation and have led to advancements in their respective fields.

Conclusion

Stephen G Bennett's contributions to semiconductor technology through his patent on TSV integration exemplify the importance of innovation in advancing device manufacturing. His work continues to influence the industry and inspire future developments.