Stephen Fredrick Clark

Title: Stephen Fredrick Clark: Innovator in Integrated Circuit Technology

Introduction

Stephen Fredrick Clark, based in Plano, Texas, is a noted inventor with a significant contribution to integrated circuit technology. He has been awarded one patent, reflecting his innovative approach towards enhancing circuit functionality and efficiency.

Latest Patents

Clark’s notable patent is titled "Capacitor contact formed concurrently with bond pad metallization." This invention presents a method for passivating and contacting a capacitor in an integrated circuit (IC) without the need for additional processing steps. The technique involves using a dielectric layer, part of the IC's protective overcoat, which is deposited directly on the capacitor while overlapping the electrode edges. Furthermore, it describes how to make contact to the top electrode of the capacitor by etching small capacitor vias during the bond pad via etch process and connecting the top electrode to other circuit elements within the IC through patterned bond pad metal.

Career Highlights

Stephen Fredrick Clark is associated with Texas Instruments, a leading American technology company known for its innovation in semiconductor design and manufacturing. His work with the company evidences his contributions to the field of electrical engineering, specifically in integrated circuits.

Collaborations

Throughout his career, Clark has collaborated with esteemed colleagues, including Maxwell Walthour Lippitt, III, and Stephen Arlon Meisner. Their collective efforts have contributed to advancements in technology and the enhancement of integrated circuit designs.

Conclusion

In summary, Stephen Fredrick Clark exemplifies the spirit of innovation in the field of integrated circuits through his creative patent work and collaborations. His contributions continue to impact technology and the development of efficient electronic components, marking him as a significant figure in the realm of inventors.