Company Filing History:
Years Active: 2007-2013
Title: **The Innovative Mind of Stephen E. Lehman: A Catalyst in Microelectronic Packaging**
Introduction
Stephen E. Lehman, an esteemed inventor based in Chandler, AZ, has made significant contributions to the field of microelectronics. With a portfolio of three patents, his work focuses on enhancing the reliability and efficiency of microelectronic packaging. His innovative solutions address challenges in solder joint reliability, showcasing his expertise in this specialized area.
Latest Patents
Lehman’s latest patents include groundbreaking inventions that optimize microelectronic assemblies. One notable patent revolves around the method of fabricating microelectronic devices, where a solder material comprising copper is applied to a nickel surface finish. This process facilitates the formation of robust solder joints, crucial for maintaining the integrity of microelectronic devices.
Additionally, he has developed a patent focusing on stress-relief layers and stress-compensation collars that utilize low-temperature solders for board-level joints. This invention involves the creation of stress-relief layers by embedding low melting-point solder bumps within a polymer substrate, enhancing the durability of the connections within electronic systems.
Career Highlights
Stephen E. Lehman currently works at Intel Corporation, one of the leading companies in microelectronics and technology innovation. His role at Intel demonstrates his commitment to advancing technological frameworks that bolster the performance and reliability of microelectronic products.
Collaborations
In his journey of innovation, Lehman collaborates with other talented individuals in the field, including Daewoong Suh and Saikumar Jayaraman. These collaborations reflect a shared vision of pushing the boundaries of what is possible in microelectronics, combining their expertise to develop inventive solutions for industry challenges.
Conclusion
Stephen E. Lehman stands as a pivotal figure in the evolution of microelectronic packaging, marked by his inventive spirit and contributions to the industry. With his patents, he continues to pave the way for innovations that enhance the reliability of electronic devices, affirming his status as a key inventor in the realm of technology.