This inventor holds 1 USPTO granted patent. Top assignee: Openai Opco, LLC. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Stephen D’souza: Semiconductor Packaging Inventor
Introduction
Stephen D’souza is an inventor associated with Morgan Hill, California. His patent work addresses semiconductor package design, with a focus on reducing warpage through a stiffener ring with varying stiffness.
Latest Patents
D’souza is credited with 1 patent: “Mitigating Semiconductor Package Warpage Using Improved Stiffener Ring.” The invention describes a semiconductor package with a substrate, a die mounted on the substrate, and a stiffener ring surrounding at least part of the die. Different portions of the ring have different effective stiffnesses, a design intended to help mitigate package warpage.
Career Highlights
The available information associates D’souza with OpenAI OpCo, LLC. His patent reflects work on structural approaches to semiconductor packaging.
Collaborations
Anthony Forte is identified as D’souza’s coworker. The available details do not specify whether Forte collaborated on the patent.
Conclusion
Stephen D’souza’s patent focuses on using a stiffener ring with varied stiffness to address warpage in semiconductor packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile