The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Feb. 20, 2026
Openai Opco, Llc., San Francisco, CA (US);
Stephen D'souza, Morgan Hill, CA (US);
Anthony Forte, San Francisco, CA (US);
OpenAI OpCo, LLC, San Francisco, CA (US);
Abstract
A semiconductor package includes a substrate, a die mounted on the substrate, and a stiffener ring mounted on the substrate and surrounding at least a portion of the die. The stiffener ring includes at least a first portion and a second portion circumferentially disposed along a perimeter of the stiffener ring. The first portion is characterized by a first effective stiffness, and the second portion is characterized by a second effective stiffness different from the first effective stiffness.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile