This inventor holds 1 USPTO granted patent. Top assignee: Openai Opco, LLC. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Anthony Forte and Semiconductor Package Warpage Mitigation.
Introduction
Anthony Forte is an inventor based in San Francisco, California. His patent work addresses semiconductor package warpage, a challenge that can affect the reliability and performance of electronic components.
Latest Patents
Forte is associated with 1 patent: “Mitigating Semiconductor Package Warpage Using Improved Stiffener Ring.” The invention describes a semiconductor package with a substrate, a die mounted on the substrate, and a stiffener ring surrounding at least part of the die. The ring has circumferential portions with different effective stiffnesses, a design intended to help mitigate package warpage.
Career Highlights
Forte is associated with OpenAI OpCo, LLC. His patent reflects work on semiconductor packaging and structural design.
Collaborations
Forte’s coworker, Stephen D’souza, is also noted in the provided information. Their professional association places the invention in a collaborative workplace context.
Conclusion
Anthony Forte’s patent focuses on using a stiffener ring with varied stiffness to address warpage in semiconductor packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile