Stefano Santi

Title: Stefano Santi: Semiconductor Package Inventor

Introduction

Stefano Santi is an inventor associated with Guanzate, Italy. His patent work concerns the design of semiconductor packages for power devices. He is associated with International Rectifier Corporation and has 1 patent listed in the information provided.

Latest Patents

Santi’s listed patent is “Compression Assembled Electronic Package Having a Plastic Molded Insulation Ring.” It describes a compression-assembled semiconductor package that houses a power semiconductor die. Two major pole pieces make electrical contact with the die’s respective major electrodes, while a molded plastic insulation ring surrounds the die and is secured to the pole pieces.

The patent also describes configurations in which an annular flange penetrates and is embedded in the insulation ring. Another arrangement embeds a flange in the ring and connects it to an annular rib on a pole piece with a circular connector. These features address the package’s structure and the relationship between its insulating ring and conductive components.

Career Highlights

The available information connects Santi’s patent activity with International Rectifier Corporation. His listed invention focuses on packaging for power semiconductors, combining electrical contact components with molded insulation.

Collaborations

Mario Merlin and Aldo Torti are identified as Santi’s coworkers. The information provided does not specify their roles in the patent or describe particular collaborative projects.

Conclusion

Stefano Santi’s listed patent documents a semiconductor package design that integrates pole pieces, a power semiconductor die, and a molded insulation ring.