The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2004

Filed:

Jan. 25, 2002
Applicant:
Inventors:

Mario Merlin, Turin, IT;

Aldo Torti, Turin, IT;

Stefano Santi, Guanzate, IT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/973 ; H01L 2/348 ; H01L 2/334 ; H01L 2/7082 ;
U.S. Cl.
CPC ...
H01L 2/973 ; H01L 2/348 ; H01L 2/334 ; H01L 2/7082 ;
Abstract

A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. An annular flange may also be embedded in the plastic molded insulation ring and connected to an annular rib of a pole piece by a circular connector.


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