Company Filing History:
Years Active: 2012-2016
Title: The Innovations of Stefan Starovecký
Introduction
Stefan Starovecký is a notable inventor based in Piestany, Slovakia. He has made significant contributions to the field of power semiconductor technology. With a total of 4 patents to his name, his work reflects a commitment to advancing electronic components and their packaging.
Latest Patents
Starovecký's latest patents include an innovative arrangement comprising at least one power semiconductor module and a transport packaging. This arrangement features a power semiconductor module that consists of a base element, a housing, and connection elements. The transport packaging is designed with a cover layer, an interlayer with a cutout for the power semiconductor module, and a cover film. The design ensures that the power semiconductor module is securely arranged within the cutout, with the base element resting on the first main surface of the cover layer. The cover film effectively covers substantial parts of the housing of the power semiconductor module, providing protection and stability.
Another patent by Starovecký also focuses on an arrangement comprising at least one power semiconductor module and a transport packaging. In this design, the power semiconductor module is housed within a trough-like plastic shaped body that partially encloses it. The arrangement allows for effective thermal management and protection of the semiconductor module, ensuring its reliability in various applications.
Career Highlights
Stefan Starovecký is currently associated with Semikron Elektronik GmbH & Co. KG, a company known for its expertise in power semiconductor solutions. His role at Semikron has allowed him to contribute to cutting-edge developments in the field, enhancing the performance and efficiency of power electronic systems.
Collaborations
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Conclusion
Stefan Starovecký's contributions to the field of power semiconductor technology are noteworthy. His innovative patents demonstrate a deep understanding of electronic components and their packaging. His work continues to influence advancements in the industry, showcasing the importance of innovation in technology.