The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Jun. 24, 2011
Applicants:

Marian Mateicka, Behynce, SK;

Jan Halaj, Piestany, SK;

Stefan Starovecky, Piestany, SK;

Pavel Kavicky, Piestany, SK;

Christian Goebl, Nürnberg, DE;

Inventors:

Marian Mateicka, Behynce, SK;

Jan Halaj, Piestany, SK;

Stefan Starovecky, Piestany, SK;

Pavel Kavicky, Piestany, SK;

Christian Goebl, Nürnberg, DE;

Assignee:

Semikron GmbH & Co., KG, Nürnberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 1/00 (2006.01); H02J 3/00 (2006.01); H01L 31/05 (2014.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/05 (2013.01); H01L 31/0485 (2013.01); H01L 31/0486 (2013.01); Y02E 10/50 (2013.01);
Abstract

A connecting device which can be arranged relative to a photovoltaic module for the purpose of electrically connecting a plurality of photovoltaic modules to one another and/or to an inverter device comprising at least a housing. The housing includes a first housing element and a second housing element; first connection devices for electrical connection to the photovoltaic module arranged in the first housing element; and second connection devices for electrical connection to a further connecting device or to the inverter device of a semiconductor circuit having at least one semiconductor component arranged in the second housing element. The connecting device further includes first contact devices, which are associated with the first housing element, and second contact devices, which are associated with the second housing element. The semiconductor circuit arrangement can be electrically connected to the first connection devices.


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