This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: The Innovative Contributions of Stefan Bonekamp
Introduction
Stefan Bonekamp is a notable inventor based in Düsseldorf, Germany. He has made significant contributions to the field of adhesive technologies, particularly through his innovative patent. His work focuses on the bonded adhesion of wire-shaped individual elements, showcasing his expertise in material science and engineering.
Latest Patents
Stefan Bonekamp holds a patent for a method involving the bonded adhesion of wire-shaped individual elements using a two-layer acrylate resin-based system. This invention relates to connecting multiple wire-shaped elements into a cohesive arrangement, such as a wire band. The method incorporates predetermined breaking points in the individual elements, allowing for mechanical removal when necessary. The two-layer system consists of an inner coating with lower hardness and an outer coating with higher hardness, enhancing the overall performance of the bonded connection.
Career Highlights
Stefan Bonekamp is associated with Henkel AG & Company, KGaA, a leading global company in adhesive technologies. His role at Henkel has allowed him to develop and refine his innovative ideas, contributing to the company's reputation for excellence in the industry. His patent reflects his commitment to advancing adhesive solutions and improving product functionality.
Collaborations
Stefan has collaborated with notable colleagues, including Andreas Kunz and Juergen Stodt. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas, further enhancing the quality of their work.
Conclusion
Stefan Bonekamp's contributions to adhesive technology through his patent demonstrate his innovative spirit and dedication to advancing the field. His work not only benefits his company but also has the potential to impact various industries that rely on effective bonding solutions.
