The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Apr. 15, 2011
Andreas Kunz, Remscheid, DE;
Juergen Stodt, Neuss, DE;
Holger Endres, Neuss, DE;
Wolfgang Schneider, Langenfeld, DE;
Stefan Bonekamp, Duesseldorf, DE;
Patrick Podwoiski, Erkrath, DE;
Andreas Kunz, Remscheid, DE;
Juergen Stodt, Neuss, DE;
Holger Endres, Neuss, DE;
Wolfgang Schneider, Langenfeld, DE;
Stefan Bonekamp, Duesseldorf, DE;
Patrick Podwoiski, Erkrath, DE;
Henkel AG & Co. KGAA, Duesseldorf, DE;
Abstract
The present invention relates to a method for the bonded adhesion, or connection, of a plurality of wire-shaped individual elements into an arrangement, particularly into a wire band, wherein the adjacent individual elements have predetermined breaking points allowing for the mechanical removal of the individual elements. The bonded adhesion is brought about according to the invention utilizing a two-layer system on the basis of acrylate resins consisting of an inner coating (A) and of an outer coating (B), wherein the inner coating (A) has a lower hardness, than the outer coating. In a further aspect the invention also comprises arranging a plurality of wire-shaped individual elements through such a bonded connection, particularly a wire band.