Srinivasan Parthasarathy

Title: Innovations of Srinivasan Parthasarathy

Introduction

Srinivasan Parthasarathy is a notable inventor based in Santa Clara, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is for a semiconductor chip with stratified underfill. This invention provides various semiconductor chip underfills and methods of making the same. The method includes coupling a semiconductor chip to a substrate, leaving a gap between them, and forming an underfill layer in that gap. The underfill layer consists of two different sizes of filler particles, which are strategically concentrated to optimize the bulk modulus of the underfill layer.

Another significant patent is for a method for forming solder joints for a flip chip assembly. This method involves a dispersed Sn microstructure and aims to create solder joints that enhance the fatigue life of the package arrangement. The process includes a specific eutectic reflow profile that ensures evenly distributed Sn grains in the solder joints, thereby improving the overall reliability of the assembly.

Career Highlights

Srinivasan has worked with prominent companies in the semiconductor industry, including Advanced Micro Devices Corporation and Globalfoundries Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Srinivasan has collaborated with talented individuals such as Raj N Master and Jun Zhai. These collaborations have contributed to the advancement of his research and inventions.

Conclusion

Srinivasan Parthasarathy's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor devices.