The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Jun. 27, 2005
Raj N. Master, San Jose, CA (US);
Srinivasan Ashok Anand, Marine Crescent, SG;
Srinivasan Parthasarathy, Sunnyvale, CA (US);
Yew Cheong Mui, Jalan Bahagia, SG;
Raj N. Master, San Jose, CA (US);
Srinivasan Ashok Anand, Marine Crescent, SG;
Srinivasan Parthasarathy, Sunnyvale, CA (US);
Yew Cheong Mui, Jalan Bahagia, SG;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.