This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Sridhar K N in Substrate Polishing Technology
Introduction
Sridhar K N is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of substrate polishing technology. His innovative work has led to the development of a patented apparatus that enhances the efficiency of substrate polishing processes.
Latest Patents
Sridhar K N holds a patent for a device titled "CMP Inner Ring in Smart Head." This invention provides an apparatus for substrate polishing, which includes a housing member, a carrier member, and a distal force assembly. The carrier member is coupled to and disposed radially outward of the housing member. The distal force assembly is located radially inward of an exterior portion of the carrier member and radially outward of the housing member. It features a bladder seal and a seal ring in contact with the bladder seal. The seal ring has a face and includes one or more grooves with specific dimensions. The plateau radius and ridge radius of the grooves are designed to optimize the polishing process, measuring between about 0.012 to about 0.018 inches.
Career Highlights
Sridhar K N is currently employed at Applied Materials, Inc., where he continues to innovate in the field of semiconductor manufacturing. His work focuses on improving the efficiency and effectiveness of substrate polishing technologies.
Collaborations
Sridhar has collaborated with Tsu-Hui Yang, contributing to advancements in their shared field of expertise.
Conclusion
Sridhar K N's contributions to substrate polishing technology through his patent demonstrate his commitment to innovation and excellence in the industry. His work at Applied Materials, Inc. continues to influence the field positively.