Sreenivas Jayaraman

Title: Innovations by Sreenivas Jayaraman

Introduction

Sreenivas Jayaraman is an accomplished inventor based in Sunnyvale, California. He has made significant contributions to the field of materials science and engineering, particularly in the area of coating and filling techniques for electronic devices.

Latest Patents

Sreenivas holds a patent titled "Methods for coating and filling high aspect ratio recessed features." This invention provides methods for conformally or superconformally coating and uniformly filling structures with a continuous layer. The methods improve coverage of surfaces and enhance fill in recessed features compared to traditional deposition methods. This innovation minimizes the formation of voids or gaps in the deposited layers, making it particularly useful for the fabrication of various electronic, electrical, and electromechanical devices.

Career Highlights

Sreenivas is affiliated with the University of Illinois, where he continues to advance research in his field. His work has garnered attention for its practical applications in technology and manufacturing processes.

Collaborations

Some of Sreenivas's notable coworkers include John Abelson and Gregory S. Girolami. Their collaborative efforts contribute to the innovative research environment at the University of Illinois.

Conclusion

Sreenivas Jayaraman's contributions to the field of coating and filling methods represent a significant advancement in the fabrication of electronic devices. His work continues to influence the industry and inspire future innovations.