The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2009

Filed:

Oct. 31, 2006
Applicants:

John R. Abelson, Urbana, IL (US);

Sreenivas Jayaraman, Sunnyvale, CA (US);

Gregory S. Girolami, Urbana, IL (US);

Yu Yang, Urbana, IL (US);

DO Young Kim, Urbana, IL (US);

Inventors:

John R. Abelson, Urbana, IL (US);

Sreenivas Jayaraman, Sunnyvale, CA (US);

Gregory S. Girolami, Urbana, IL (US);

Yu Yang, Urbana, IL (US);

Do Young Kim, Urbana, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides methods for conformally or superconformally coating and/or uniformly filling structures with a continuous, conformal layer or superconformal layer. Methods of the present invention improve conformal or superconformal coverage of surfaces and improve fill in recessed features compared to conventional physical deposition and chemical deposition methods, thereby minimizing formation of voids or gaps in a deposited conformal or superconformal layer. The present methods are capable of coating or filling features useful for the fabrication of a broad class of electronic, electrical and electromechanical devices.


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