Spyridon Galis

Title: Spyridon Galis: Innovator in 3D Chip Integration

Introduction

Spyridon Galis is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of 3D chip integration. With a total of 2 patents, his work has garnered attention for its innovative approaches to enhancing chip performance and reliability.

Latest Patents

One of Spyridon Galis's latest patents is focused on a hybrid bonding interface for 3-dimensional chip integration. This invention involves substrates that include surfaces with diffusion-resistant dielectric materials, such as silicon nitride. Recessed regions are created in these materials and filled with bondable dielectric materials. The design features mirror symmetry in the patterns of metal pads and bondable dielectric portions on both substrates. When the substrates are brought into contact, they are bonded through the metal pads and the bondable dielectric material portions. Additionally, through-substrate-via (TSV) structures are formed, and the bonding interface is encapsulated by diffusion-resistant dielectric layers to contain metal diffusion.

Career Highlights

Spyridon Galis is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of technology. His work is instrumental in developing advanced solutions that address the challenges of modern chip design and integration.

Collaborations

Throughout his career, Spyridon has collaborated with esteemed colleagues, including Karl W Barth and Ricardo Alves Donaton. These partnerships have contributed to the successful development of innovative technologies in the semiconductor industry.

Conclusion

Spyridon Galis stands out as a key figure in the realm of 3D chip integration, with his patents reflecting a commitment to advancing semiconductor technology. His contributions are vital to the ongoing evolution of electronic devices and systems.