Company Filing History:
Years Active: 2023-2025
Title: Souichirou Komiya: Innovator in Adhesive Technology
Introduction
Souichirou Komiya is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technology, holding a total of 3 patents. His work focuses on developing innovative adhesive compositions that enhance bonding capabilities in various applications.
Latest Patents
Komiya's latest patents include a moisture-curable hot-melt adhesive composition and a reactive hot-melt adhesive composition. The moisture-curable hot-melt adhesive composition features a urethane prepolymer that includes a polymer chain derived from both polyol and polyisocyanate, possessing two or more isocyanate groups. Additionally, it incorporates a modified urethane prepolymer with isocyanate groups modified with castor oil monool. The reactive hot-melt adhesive composition consists of a urethane prepolymer with a terminal isocyanate group and a functional group protection type silane coupling agent, showcasing his innovative approach to adhesive formulations.
Career Highlights
Throughout his career, Souichirou Komiya has worked with prominent companies such as Resonac Corporation and Showa Denko Materials Co., Ltd. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to advancements in the industry.
Collaborations
Komiya has collaborated with various professionals in his field, including his coworker Kazuyuki Magome. These collaborations have further enriched his work and led to the development of cutting-edge adhesive solutions.
Conclusion
Souichirou Komiya's contributions to adhesive technology through his patents and collaborations highlight his role as an innovator in the field. His work continues to influence the development of advanced adhesive compositions that meet the needs of various industries.