This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Innovator Soon Chuan Ong: Pioneering Package Warpage Control
Introduction
Soon Chuan Ong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of packaging technology. His innovative approach focuses on controlling package warpage, which is crucial for ensuring product integrity during processing.
Latest Patents
Soon Chuan Ong holds a patent for a method of package warpage control. This method involves placing a restrainer on a package during processing. The restrainer is clipped in place, and the package is then exposed to high temperatures. After processing, the restrainer is removed. An alternative process includes attaching a component die to a substrate with a cavity on its first surface. This process may also involve dispensing and curing an underfill material in the cavity, followed by attaching a lid to the first surface of the substrate. He has 1 patent to his name.
Career Highlights
Soon Chuan Ong is currently employed at Intel Corporation, where he continues to innovate in packaging technology. His work is instrumental in enhancing the reliability and performance of packaged products.
Collaborations
He collaborates with talented colleagues, including Michael Keat Lye Lee and Hooi Jin Teng. Their combined expertise contributes to the advancement of packaging solutions.
Conclusion
Soon Chuan Ong's contributions to package warpage control exemplify the importance of innovation in technology. His work at Intel Corporation and his patent highlight his commitment to improving packaging processes.