Suwon, South Korea

Soon-bum Kim


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 80(Granted Patents)


Company Filing History:


Years Active: 2006-2007

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2 patents (USPTO):Explore Patents

Title: The Innovations of Soon-bum Kim

Introduction

Soon-bum Kim is an accomplished inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, with a total of two patents to his name. His innovative approaches focus on enhancing the reliability of solder bump structures used in electronic devices.

Latest Patents

Among his most recent patents is the "Reinforced solder bump structure and method for forming a reinforced solder bump." This invention introduces a novel connector structure formed between a contact pad on a semiconductor chip and a ball pad on a mounting substrate. The semiconductor chip features at least one reinforcing protrusion extending from an intermediate layer, while the mounting substrate includes a similar protrusion from the ball pad.

The design enables both protrusions to be embedded within the solder bump connector, which improves reliability by suppressing crack formation and propagation. In various configurations, these reinforcing protrusions are arranged so that their upper portions overlap without contact, allowing for multiple arrangements, including pin arrays. This innovative approach significantly enhances the durability of semiconductor connections.

Career Highlights

Soon-bum Kim is currently employed by Samsung Electronics Co., Ltd., a leading global technology company known for its advancements in electronics and semiconductors. Within the company, he has cultivated a reputation for his inventive contributions to the field. His patents showcase his commitment to improving semiconductor technology and ensuring higher levels of reliability in electronic devices.

Collaborations

Throughout his career, Soon-bum Kim has had the opportunity to work alongside talented colleagues, including Se-young Jeong and Nam-seog Kim. These collaborations have led to valuable insights and advancements in their shared projects, blending expertise and innovation to push the boundaries of technology further.

Conclusion

Soon-bum Kim stands out as a notable inventor in the semiconductor industry, recognized for his innovative solder bump structures that significantly improve the reliability of electronic connections. His work at Samsung Electronics Co., Ltd., along with his collaborative spirit, continues to inspire breakthrough advancements in technology.

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