The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Apr. 16, 2004
Se-young Jeong, Suwon, KR;
Nam-seog Kim, Yongin, KR;
Oh-se Yong, Yongin, KR;
Soon-bum Kim, Suwon, KR;
Sun-young Park, Iksan, KR;
Ju-hyun Lyu, Cheonan, KR;
In-young Lee, Yongin, KR;
Se-young Jeong, Suwon, KR;
Nam-seog Kim, Yongin, KR;
Oh-se Yong, Yongin, KR;
Soon-bum Kim, Suwon, KR;
Sun-young Park, Iksan, KR;
Ju-hyun Lyu, Cheonan, KR;
In-young Lee, Yongin, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.