Se-young Jeong

Title: Se-young Jeong: Innovator in Semiconductor Technology

Introduction

Se-young Jeong is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of reinforced solder bump structures. With a total of two patents to his name, his work has implications for improving the reliability of semiconductor connections.

Latest Patents

Se-young Jeong's latest patents focus on a reinforced solder bump connector structure. This innovative design is formed between a contact pad on a semiconductor chip and a ball pad on a mounting substrate. The semiconductor chip features at least one reinforcing protrusion that extends upwardly from an intermediate layer. Similarly, the mounting substrate includes at least one reinforcing protrusion from a ball pad. These protrusions from both the chip and substrate are embedded within the solder bump connector. The configurations allow for overlapping upper portions of the protrusions, which can take various forms, including pin arrays. This design effectively suppresses crack formation and propagation, thereby enhancing the reliability of semiconductor devices.

Career Highlights

Se-young Jeong is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to focus on innovative solutions that address challenges in semiconductor manufacturing and reliability.

Collaborations

Se-young Jeong has collaborated with notable colleagues, including Nam-seog Kim and Oh-se Yong. These collaborations have contributed to the advancement of technology in their field.

Conclusion

Se-young Jeong's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as an innovator in the industry. His developments in reinforced solder bump structures are paving the way for more reliable semiconductor connections.