Company Filing History:
Years Active: 2019
Title: Innovations by Songli Hu in Silicon Wafer Technology
Introduction
Songli Hu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of silicon wafer processing. With a total of 2 patents, his work has advanced the efficiency and effectiveness of wafer handling and alignment.
Latest Patents
One of Songli Hu's latest patents is the "Silicon wafer pre-alignment device and method therefor." This invention includes a first unit designed to drive a wafer to rotate or move vertically, and a second unit that facilitates the wafer's translation. A position detector, comprising a light source, a lens, and an image sensor, provides critical information about the wafer's position. The system allows for precise adjustments based on the data obtained from the image sensor. Another notable patent is the "Silicon wafer transportation system," which is a comprehensive wafer transfer system for photolithography applications. This system features a dual-arm robot for efficient wafer handling, along with a pre-alignment apparatus and linear robots for loading and unloading wafers. The design enables parallel operations, significantly reducing transfer times.
Career Highlights
Songli Hu has worked with notable companies such as Shanghai Micro Electronics Equipment (Group) Co., Ltd. and Shanghai Micro Electronics Equipment Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative technologies in the semiconductor industry.
Collaborations
Throughout his career, Songli Hu has collaborated with talented individuals, including Jie Jiang and Weiwang Sun. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Songli Hu's contributions to silicon wafer technology through his innovative patents demonstrate his expertise and commitment to advancing the semiconductor industry. His work continues to influence the efficiency of wafer processing and handling systems.