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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10254661 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

May. 20, 2016

Silicon wafer transportation system

Applicant:

Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;

Inventors:

Kai Liu, Shanghai, CN;

Songli Hu, Shanghai, CN;

Jie Jiang, Shanghai, CN;

Assignee:

SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD., Shanghai, CN;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Mesfin T Asfaw

Int. Cl.
CPC ...
G03B 27/42 (2006.01); G03B 27/58 (2006.01); G03F 7/20 (2006.01); G03F 9/00 (2006.01); B25J 9/00 (2006.01); B25J 9/04 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01); B25J 15/06 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70733 (2013.01); B25J 9/0087 (2013.01); B25J 9/0096 (2013.01); B25J 9/041 (2013.01); B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); B25J 15/0683 (2013.01); G03F 7/20 (2013.01); G03F 9/00 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 21/67766 (2013.01); H01L 21/67769 (2013.01); H01L 21/68707 (2013.01); Y10S 901/17 (2013.01); Y10S 901/23 (2013.01); Y10S 901/40 (2013.01);
Abstract

A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers.

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