SongGan Zang

Title: The Innovations of SongGan Zang

Introduction

SongGan Zang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the efficiency of 3D packaging systems.

Latest Patents

SongGan Zang holds a patent for a cost-saving scheme for scan testing of 3D stack die. This patent describes a system and method for efficiently routing scan data between two dies used in three-dimensional packaging. The computing system includes at least a first semiconductor die and a second die connected within a 3D package. The first and second dies have multiple non-scan input/output (I/O) data channels for data transfer. These channels are partitioned into groups to optimize performance. The first die receives a scan input data bit for testing a device under test (DUT) on the second die. It selects a group of non-scan I/O data channels and sends a copy of the scan input data bit through each channel. The second die utilizes a voter circuit to determine the value of the scan input data bit.

Career Highlights

SongGan Zang is currently employed at Advanced Micro Devices Corporation, a leading company in semiconductor technology. His work at AMD has allowed him to contribute to innovative solutions in the industry. He has a total of 1 patent to his name, showcasing his inventive capabilities.

Collaborations

Some of his coworkers include Qi Shao and Lifeng Zhang. Their collaboration has likely contributed to the advancements in their projects at AMD.

Conclusion

SongGan Zang's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the efficiency of 3D packaging systems.