Chandler, AZ, United States of America

Song Y Chang

This inventor holds 1 USPTO granted patent. Top assignee: Versum Materials US, LLC. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Song Y Chang. Retrieved from https://idiyas.com/inventor/song-y-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovations of Song Y Chang

Introduction

Song Y Chang is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of chemical mechanical planarization (CMP) through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of metal layer removal processes, particularly in semiconductor manufacturing.

Latest Patents

Song Y Chang holds a patent titled "Composition and method used for chemical mechanical planarization of metals." This patent describes compositions for use in CMP processing and methods of CMP processing. The composition utilizes low levels of particulate material, in combination with at least one amino acid, at least one oxidizer, and water to remove a metal layer, such as one containing copper, to a stop layer with high selectivity. He has 1 patent to his name.

Career Highlights

Currently, Song Y Chang is employed at Versum Materials US, LLC, where he continues to develop innovative solutions in the field of materials science. His expertise in CMP processing has positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, Song has collaborated with talented professionals, including Mark Evans and Dnyanesh Chandrakant Tamboli. These collaborations have further enriched his work and contributed to advancements in CMP technology.

Conclusion

Song Y Chang's contributions to the field of chemical mechanical planarization demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the technology used for metal layer removal, showcasing his expertise and dedication to improving manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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