IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Song-Hua Shi

USPTO Granted Patents = 18

Average Co-Inventor Count = 1.8

ph-index = 8

Forward Citations = 183(Granted Patents)


Location History:

  • Atlanta, GA (US) (2001)
  • Phoenix, AZ (US) (2004 - 2009)

Company Filing History:

goldMedal16 out of 54,664 
 
Intel Corporation
 patents
silverMedal2 out of 2,072 
 
Georgia Tech Research Corporation
 patents

Years Active: 2001-2009

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18 patents (USPTO):Explore Patents
1. 7498678 - Electronic assemblies and systems with filled no-flow underfill (2009-03-03),
2. 7470564 - Flip-chip system and method of making same (2008-12-30),
3. 7391119 - Temperature sustaining flip chip assembly process (2008-06-24),
4. 7323360 - Electronic assemblies with filled no-flow underfill (2008-01-29),
5. 7218007 - Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices (2007-05-15),
6. 7179684 - Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material (2007-02-20),
7. 7176422 - Chip bonding heater with differential heat transfer (2007-02-13),
8. 7145120 - Guided heating apparatus and method for using the same (2006-12-05),
9. 6940053 - Chip bonding heater with differential heat transfer (2005-09-06),
10. 6902954 - Temperature sustaining flip chip assembly process (2005-06-07),
11. 6899960 - Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material (2005-05-31),
12. 6794761 - No-flow underfill material (2004-09-21),
13. 6794623 - Guided heating apparatus and method for using the same (2004-09-21),
14. 6746896 - Process and material for low-cost flip-chip solder interconnect structures (2004-06-08),
15. 6730542 - Polybenzoxazine based wafer-level underfill material (2004-05-04),
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