Location History:
- Atlanta, GA (US) (2001)
- Phoenix, AZ (US) (2004 - 2009)
Company Filing History:
Years Active: 2001-2009
Title: Innovations of Inventor Song-Hua Shi
Introduction
Song-Hua Shi is a prominent inventor based in Phoenix, AZ (US). He has made significant contributions to the field of electronic assemblies and systems, holding a total of 18 patents. His work focuses on enhancing the reliability and efficiency of flip-chip integrated circuit (IC) packages.
Latest Patents
Among his latest patents, one notable invention is related to electronic assemblies and systems with filled no-flow underfill. This innovation achieves high yield and high reliability in flip-chip IC packages by utilizing a combination of heat and pressure to bond flip-chip die and cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material, which decreases the CTE of the cured underfill. The filler material can be selected from a group that includes silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. Additionally, the filler material may increase the viscosity of the uncured underfill and/or enhance the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is employed to simultaneously provide solder bump reflow and underfill curing. Another significant patent involves a flip-chip system and method of making the same, which includes an underfill mixture that ameliorates the CTE mismatch typically found between a packaged die and a resin-impregnated fiberglass mounting substrate.
Career Highlights
Throughout his career, Song-Hua Shi has worked with notable companies such as Intel Corporation and Georgia Tech Research Corporation. His expertise in electronic systems has positioned him as a key figure in the development of advanced packaging technologies.
Collaborations
Song-Hua Shi has collaborated with several professionals in his field, including Tian-An Chen and Lejun Wang. Their combined efforts have contributed to the advancement of innovative solutions in electronic assembly technologies.
Conclusion
In summary, Song-Hua Shi is a distinguished inventor whose work in electronic assemblies has led to numerous patents and advancements in the field. His contributions continue to influence the development of reliable and efficient electronic systems.