This inventor holds 18 USPTO granted patents, primarily in Flip-Chip Technology. Top assignees: Intel Corporation, Georgia Tech Research Corporation. Active years: 2001-2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Atlanta, GA (US) (2001)
- Phoenix, AZ (US) (2004 - 2009)
Company Filing History:
Years Active: 2001-2009
Areas of Expertise:
Title: Innovations of Inventor Song-Hua Shi
Introduction
Song-Hua Shi is a prominent inventor based in Phoenix, AZ (US). He has made significant contributions to the field of electronic assemblies and systems, holding a total of 18 patents. His work focuses on enhancing the reliability and efficiency of flip-chip integrated circuit (IC) packages.
Latest Patents
Among his latest patents, one notable invention is related to electronic assemblies and systems with filled no-flow underfill. This innovation achieves high yield and high reliability in flip-chip IC packages by utilizing a combination of heat and pressure to bond flip-chip die and cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material, which decreases the CTE of the cured underfill. The filler material can be selected from a group that includes silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. Additionally, the filler material may increase the viscosity of the uncured underfill and/or enhance the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is employed to simultaneously provide solder bump reflow and underfill curing. Another significant patent involves a flip-chip system and method of making the same, which includes an underfill mixture that ameliorates the CTE mismatch typically found between a packaged die and a resin-impregnated fiberglass mounting substrate.
Career Highlights
Throughout his career, Song-Hua Shi has worked with notable companies such as Intel Corporation and Georgia Tech Research Corporation. His expertise in electronic systems has positioned him as a key figure in the development of advanced packaging technologies.
Collaborations
Song-Hua Shi has collaborated with several professionals in his field, including Tian-An Chen and Lejun Wang. Their combined efforts have contributed to the advancement of innovative solutions in electronic assembly technologies.
Conclusion
In summary, Song-Hua Shi is a distinguished inventor whose work in electronic assemblies has led to numerous patents and advancements in the field. His contributions continue to influence the development of reliable and efficient electronic systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile