The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Mar. 31, 2003
Applicant:
Song-hua Shi, Phoenix, AZ (US);
Inventor:
Song-Hua Shi, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.
Shi, Song-Hua. (2005). Temperature sustaining flip chip assembly process (U.S. Patent No. 6902954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6902954
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile