Song-Fei Wang

Title: Innovations by Song-Fei Wang in Semiconductor Technology

Introduction

Song-Fei Wang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving manufacturing processes, which can lead to cost reductions and enhanced efficiency in production.

Latest Patents

One of his latest patents is a method for fabricating a stacked chip package. This innovative method includes several steps: first, attaching a first semiconductor chip to the upper surface of a substrate using a first adhesive layer. Next, the first adhesive layer is partially cured to a gel state without hardening. Following this, a second semiconductor chip is attached to the first chip through a second adhesive layer. Both adhesive layers are then cured, and the chips are electrically coupled to a structure for external electrical connections on the substrate. Finally, a package body is formed over the chips and a portion of the substrate. This method allows for the curing of both adhesive layers in a single step, which reduces cycle time and production costs.

Career Highlights

Song-Fei Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor manufacturing. His work has been instrumental in advancing the efficiency of chip packaging processes.

Collaborations

He collaborates with talented coworkers, including Pao-Hei Chang Chin and Chung-Hao Lee, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Song-Fei Wang's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and efficiency in manufacturing processes. His work not only enhances production capabilities but also significantly reduces costs in the industry.