Matsumoto, Japan

Soji Shiozawa

This inventor holds 1 USPTO granted patent and 11 published patent applications. Top assignee: Seiko Epson Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Soji Shiozawa. Retrieved from https://idiyas.com/inventor/soji-shiozawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Soji Shiozawa: Inventor of a Molding Management System.

Introduction

Soji Shiozawa is an inventor based in Matsumoto, Japan, and is associated with Seiko Epson Corporation. His patent work includes a system designed to help manage defect classifications in molding operations.

Latest Patents

Shiozawa is credited with 1 patent, titled “Molding Management System.” The invention uses a memory and processor to store device identification information and master data containing defect classifications. After a user selects a device, the system displays the defect classifications associated with that device while withholding classifications associated with other devices. When a defect occurs in a molded article, the system allows the user to select a relevant classification in association with the device involved.

Career Highlights

The patent reflects an approach to organizing molding-related information by linking defect classifications to specific devices. This can help users select relevant classifications when recording defects in molded articles.

Collaborations

Shiozawa’s listed company affiliation is Seiko Epson Corporation. The available information identifies the company in connection with his patent but does not specify further collaborators.

Conclusion

Soji Shiozawa’s molding management system focuses on connecting device identification with relevant defect classifications, providing a structured method for recording molding defects.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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