The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Mar. 22, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kosuke Atsuta, Shiojiri, JP;

Soji Shiozawa, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 2219/32368 (2013.01);
Abstract

A molding management system includes a memory and a processor. The processor is configured to execute a program so as to store a plurality of pieces of device identification information relating to a plurality of devices, store master data including a plurality of pieces of defect classification information, receive selection of the device identification information, output and display defect classification information associated with the selected device identification information among the plurality of pieces of defect classification information, output and not display defect classification information associated with device identification information other than the selected device identification information, and receive, in a case where the defect occurs in the molded article, selection of the defect classification information in association with the device identification information of one of the plurality of devices when the defect occurs.


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Atsuta, Kosuke. (2026). Molding management system (U.S. Patent No. 12761636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12761636

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