This inventor holds 1 USPTO granted patent and 19 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Soham Agarwal - Innovator in Microelectronic Assembly
Introduction
Soham Agarwal is an inventor based in Chandler, AZ (US). He is known for his contributions to the field of microelectronics, particularly in the design and development of advanced semiconductor packages. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Soham Agarwal has submitted several notable patent applications, including:
1. **SEMICONDUCTOR PACKAGE WITH BRIDGE DIE OVER EMBEDDED INTERPOSER** - This microelectronic assembly features a substrate with a first substrate face and a second substrate face opposite the first. An interposer is integrated into the substrate, with a bridge die positioned over it. The design includes a first set of electrical connections between the bridge die and interposer, and a second set of connections between the interposer and substrate, with the latter having a greater number of connections.
2. **CORE JOINING FOR EMBEDDED DIE WITHIN PACKAGE SUBSTRATES** - This application describes an IC device package that includes an IC die embedded within a substrate comprising two or more cores. A cutout in the first core exposes a surface of a second core, allowing for the placement of an IC die. The design incorporates a metallization routing structure with conductive vias adjacent to the embedded IC die, facilitating interconnect interfaces.
Conclusion
Soham Agarwal is an emerging inventor in the field of microelectronics, with innovative patent applications that showcase his expertise in semiconductor packaging. His work has the potential to influence future developments in the industry.