Daejeon, South Korea

So Jeong Kim

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Nexflex Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: So Jeong Kim. Retrieved from https://idiyas.com/inventor/so-jeong-kim-sdwxc161

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: So Jeong Kim: Innovator in Polyimide Technology

Introduction

So Jeong Kim is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of materials science, particularly in the development of polyimide varnish compositions. His work focuses on creating flexible substrates that exhibit exceptional properties.

Latest Patents

So Jeong Kim holds a patent for a "Polyimide varnish composition for flexible substrate and polyimide film using same." This invention relates to a polyimide varnish composition that includes an acid anhydride, specifically 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), along with a diamine. The composition is designed to manufacture polyimide films that possess heat resistance, high flexural properties, and enhanced flexibility, all while maintaining a low coefficient of thermal expansion.

Career Highlights

So Jeong Kim is currently employed at Nexflex Co., Ltd., where he continues to innovate in the field of flexible materials. His expertise in polyimide technology has positioned him as a key player in the industry.

Collaborations

He collaborates with talented individuals such as Joo Young Kim and Hyuk Jun Kim, contributing to advancements in their shared field of research and development.

Conclusion

So Jeong Kim's work in polyimide varnish compositions showcases his innovative spirit and dedication to enhancing material properties. His contributions are paving the way for advancements in flexible substrates and films.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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