The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Dec. 27, 2021
Applicant:

Nexflex Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

So Jeong Kim, Daejeon, KR;

Joo Young Kim, Sejong-si, KR;

Hyuk Jun Kim, Daejeon, KR;

Assignee:

NEXFLEX CO., LTD., Chungcheongbuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); B29C 41/00 (2006.01); B29C 41/42 (2006.01); C09D 179/08 (2006.01); B29K 79/00 (2006.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); B29C 41/003 (2013.01); B29C 41/42 (2013.01); B29K 2079/08 (2013.01); B29L 2007/008 (2013.01); B29L 2031/34 (2013.01);
Abstract

The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.


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