logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11965110 B1

PDFFull Text
Date of Patent:
Apr. 23, 2024

Filed:

Dec. 27, 2021

Polyimide varnish composition for flexible substrate and polyimide film using same

Applicant:

Nexflex Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

So Jeong Kim, Daejeon, KR;

Joo Young Kim, Sejong-si, KR;

Hyuk Jun Kim, Daejeon, KR;

Assignee:

NEXFLEX CO., LTD., Chungcheongbuk-Do, KR;

Attorney:

Heslin Rothenberg Farley & Mesiti P.C.

Primary Examiner:

Gregory Listvoyb

Int. Cl.
CPC ...
C08G 73/10 (2006.01); B29C 41/00 (2006.01); B29C 41/42 (2006.01); C09D 179/08 (2006.01); B29K 79/00 (2006.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); B29C 41/003 (2013.01); B29C 41/42 (2013.01); B29K 2079/08 (2013.01); B29L 2007/008 (2013.01); B29L 2031/34 (2013.01);
Abstract

The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.

Find Patent Forward Citations

Kim, So. (2024). Polyimide varnish composition for flexible substrate and polyimide film using same (U.S. Patent No. 11965110). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11965110

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…