Company Filing History:
Years Active: 2024
Title: Hyuk Jun Kim: Innovator in Polyimide Technology
Introduction
Hyuk Jun Kim is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of materials science, particularly in the development of polyimide varnish compositions. His innovative work has implications for flexible substrates and films, which are essential in various high-tech applications.
Latest Patents
Hyuk Jun Kim holds a patent for a "Polyimide varnish composition for flexible substrate and polyimide film using same." This patent describes a polyimide varnish composition that includes an acid anhydride, specifically 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), along with a diamine. The composition is designed to produce a polyimide film that exhibits heat resistance, high flexural properties, and enhanced flexibility, all while maintaining a low coefficient of thermal expansion.
Career Highlights
Throughout his career, Hyuk Jun Kim has worked with prominent companies in the industry, including Nexflex Co., Ltd. and SK Innovation Co., Ltd. His experience in these organizations has allowed him to refine his expertise in polymer technology and contribute to advancements in flexible materials.
Collaborations
Hyuk Jun Kim has collaborated with talented individuals such as So Jeong Kim and Joo Young Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Hyuk Jun Kim's contributions to polyimide technology highlight his role as a key innovator in the field. His patent for a polyimide varnish composition demonstrates his commitment to advancing materials science. His work continues to influence the development of flexible substrates and films, showcasing the importance of innovation in modern technology.