Simon A Zaidel

Title: Simon A Zaidel: Innovator in Semiconductor Technology

Introduction

Simon A Zaidel is a notable inventor based in Manlius, NY (US), recognized for his contributions to semiconductor technology. He holds a total of 4 patents, showcasing his innovative spirit and technical expertise in the field.

Latest Patents

Zaidel's latest patents include a "Process for making air bridges for integrated circuits." This invention relates to an air bridge and an evaporative process for making air bridges. A first layer of photoresist is patterned to create two openings over the contacts to be connected, separated by a strip of photoresist. The photoresist strip is hard baked to allow it to soften and to cause further cross-linking. The softening allows surface tension to reshape the photoresist strip to create a gradually sloping arcuate surface between contact openings upon which a metal layer of nearly constant thickness may be evaporated. A second layer of photoresist is then applied and patterned to create a single large opening embracing both contacts and the now arcuate hard baked photoresist strip. An arch within the large opening connecting both contacts is formed by evaporation. Excess metal and both photoresist layers are then removed, leaving a novel, arch-shaped air bridge.

Another significant patent is the "Method and apparatus for cleaving a semiconductor wafer into individual die." This invention discloses a novel method and apparatus for cleaving semiconductor wafers into individual die, which comprises mounting the wafer upon an adherent resilient air impermeable membrane while the latter is flat. Cleaving is achieved by using air pressure to inflate the membrane to cause bending and tensile stresses on the wafer brought about by its adhesion to the inflating membrane. These stresses cleave the wafer along the scribe marks to form individual die. The die may be easily removed by the application of a vacuum to the underside of the membrane, which draws it against a perforated undulatory grid dimensioned according to the die dimensions to reduce the surface contact. This reduces adhesion of the die to the membrane to facilitate a low-stress pick-off of the die.

Career Highlights

Throughout his career, Simon A Zaidel has worked with prominent companies such as General Electric Company and Martin Marietta Corporation. His experience in these organizations has contributed significantly to his development as an inventor and innovator in the semiconductor field.