The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 1983

Filed:

Oct. 21, 1981
Applicant:
Inventors:

Ronald J Naster, Syracuse, NY (US);

Simon A Zaidel, Liverpool, NY (US);

Ying-Chen Hwang, Liverpool, NY (US);

Earl L Parks, Liverpool, NY (US);

William R Cady, Scotia, NY (US);

Assignee:

General Electric Company, Syracuse, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
2957 / ; 29571 ; 2957 / ; 148-15 ; 148187 ; 357 23 ; 357 49 ; 357 51 ;
Abstract

A fabrication technique for monolithic microwave integrated circuits employs silicon-on-sapphire wafers. Active and passive elements are formed together in a series of implant and deposition steps. Electrically isolated islands of semiconductor material are defined upon the substrate. Multiple metallization deposits are employed to simultaneously interconnect the individual circuit elements and form passive elements upon the integrated circuit. The technique allows mass production of integrated circuits with considerable raw material savings.


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