Wolfurt, Austria

Siegfried Wiltsche

This inventor holds 4 USPTO granted patents and 3 EPO patents. Top assignee: Leica Geosystems Ag. Active years: 2016-2021.


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2021

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4 patents (USPTO):Explore Patents

Title: Siegfried Wiltsche: Innovator in 3D Surveying Technologies

Introduction

Siegfried Wiltsche is a notable inventor based in Wolfurt, Austria. He has made significant contributions to the field of 3D surveying technologies, holding a total of 4 patents. His innovative methods have advanced the way 3D models are created and measured, showcasing his expertise in this specialized area.

Latest Patents

Wiltsche's latest patents include a "Method for 2D Picture Based Conglomeration in 3D Surveying." This method allows for the creation of a true-to-size 3D model from a 3D scene by deriving overlapping 3D-partial models from 2D visual images. Another significant patent is the "Image-Based Edge Measurement," which enables automatic edge measurement of a scene using a handheld apparatus. This method captures images and evaluates them photogrammetrically, displaying edge lengths without user intervention.

Career Highlights

Siegfried Wiltsche is currently employed at Leica Geosystems AG, a company renowned for its precision measurement and surveying solutions. His work at Leica has allowed him to develop and refine his innovative techniques, contributing to the company's reputation as a leader in the industry.

Collaborations

Wiltsche has collaborated with talented coworkers such as Bernhard Metzler and Tobias Heller. Their combined expertise has fostered an environment of innovation and creativity, leading to advancements in surveying technologies.

Conclusion

Siegfried Wiltsche's contributions to 3D surveying technologies through his patents and work at Leica Geosystems AG highlight his role as a key innovator in the field. His methods continue to influence the way 3D models are created and measured, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
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